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RoHS-Compliant/Lead-Free
Packaging
RoHS-Compliant/Lead-Free
Packaging
April, 2007

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Agenda
Introduction
RoHS-compliant vs. Lead-free
GSI RoHS-compliant/Lead-free strategy
RoHS-compliant package qualification
RoHS-compliant package roadmap
Introduction
RoHS-compliant vs. Lead-free
GSI RoHS-compliant/Lead-free strategy
RoHS-compliant package qualification
RoHS-compliant package roadmap

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Introduction
Jan 27th, 2003 EU passed two Directives
Restriction of the use of certain Hazardous Substances (RoHS) in
electrical and electronic equipment
Waste Electrical and Electronic Equipment (WEEE)
August 13th, 2005 onwards
Producers are required to finance the collection, treatment, recycling,
and recovery of all WEEE
July 1, 2006, Electrical and Electronic Equipment will no longer be
sold in EU if it contains lead(Pb), cadmium(Cd), mercury(Hg),
hexavalent chromium(Cr+^), polybrominated biphenyls(PBB), and
polybrominated diphenyl ethers(PBDE) exceeding the prescribed
concentrations
Jan 27th, 2003 EU passed two Directives
Restriction of the use of certain Hazardous Substances (RoHS) in
electrical and electronic equipment
Waste Electrical and Electronic Equipment (WEEE)
August 13th, 2005 onwards
Producers are required to finance the collection, treatment, recycling,
and recovery of all WEEE
July 1, 2006, Electrical and Electronic Equipment will no longer be
sold in EU if it contains lead(Pb), cadmium(Cd), mercury(Hg),
hexavalent chromium(Cr+^), polybrominated biphenyls(PBB), and
polybrominated diphenyl ethers(PBDE) exceeding the prescribed
concentrations

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RoHs-Compliant vs. Lead-Free
Lead-Free Definition
Terminals:
Leaded package: pure matt tin
BGA package:
Sn4.0Ag0.5Cu
Lead (Pb) < 1000 ppm
RoHS-Compliant Definition
Terminals:
Leaded package: pure matt tin
BGA package:
Sn4.0Ag0.5Cu
Lead (Pb) < 1000 PPM
Mercury (Hg) < 1000 PPM
Hexavalent Chromium (Cr+6) < 1000 PPM
Cadium (Cd) < 100 PPM
PBB < 1000 PPM
PBDE < 1000 PPM
Lead-Free Definition
Terminals:
Leaded package: pure matt tin
BGA package:
Sn4.0Ag0.5Cu
Lead (Pb) < 1000 ppm
RoHS-Compliant Definition
Terminals:
Leaded package: pure matt tin
BGA package:
Sn4.0Ag0.5Cu
Lead (Pb) < 1000 PPM
Mercury (Hg) < 1000 PPM
Hexavalent Chromium (Cr+6) < 1000 PPM
Cadium (Cd) < 100 PPM
PBB < 1000 PPM
PBDE < 1000 PPM

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GSI RoHS-Compliant/Lead-Free
Strategy
GSI RoHS-Compliant/Lead-Free
Strategy
Offer only fully (6/6) RoHS-compliant (green) packages (except flip
chip BGA devices)
Work with assembly subcontractors on qualifying Pb-free plating
process and Pb-free solder balls
All RoHS-compliant packages are JEDEC MSL level 3 at 260°C
reflow
Offer both standard (5/6 RoHS-compliant) and fully (6/6) RoHS-
compliant products until customers are fully converted
6/6 RoHS-compliant (green) samples are currently available—“G”
character is added to package designator and is marked on the
package
Ex: GS832032T (standard)
GS832032GT (RoHS-compliant)
Offer only fully (6/6) RoHS-compliant (green) packages (except flip
chip BGA devices)
Work with assembly subcontractors on qualifying Pb-free plating
process and Pb-free solder balls
All RoHS-compliant packages are JEDEC MSL level 3 at 260°C
reflow
Offer both standard (5/6 RoHS-compliant) and fully (6/6) RoHS-
compliant products until customers are fully converted
6/6 RoHS-compliant (green) samples are currently available—“G”
character is added to package designator and is marked on the
package
Ex: GS832032T (standard)
GS832032GT (RoHS-compliant)

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RoHS-Compliant Package
Qualification
RoHS-Compliant Package
Qualification
Test Method
S.S.
Duration
Test Condition
Preconditioning
(MSL 3)
336/lot, 3 lots
N/A
30°C/60% RH/192 hrs + IR
x 3 (260°C)
HTOL
105/lot, 3 lots
1000 hours
125°C
Temp Cycle
77/lot, 3 lots
1000 cycles
-55°C/125°C
HAST
77/lot, 3 lots
264 hrs
110°C/85% RH
Autoclave
77/lot, 3 lots
96 hrs
121°C/100% RH/15psig
Thermal Shock
15/lot, 3 lots
300 cycles
-55°C to 125°C

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RoHS-Compliant Package
Qualification (cont.)
RoHS-Compliant Package
Qualification (cont.)
Solderability
GSI does not perform a solderability test in-house; the
RoHS-compliant package solderability is evaluated based
on the data conducted by assembly subcontractor per J-STD-
002B
Sn Whisker
GSI does not perform a tin whisker test in-house
RoHS-compliant package tin whisker is evaluated based
on data conducted by assembly subcontractor
GSI’s tin whisker criteria: < 50um w/ any L/F type
Solderability
GSI does not perform a solderability test in-house; the
RoHS-compliant package solderability is evaluated based
on the data conducted by assembly subcontractor per J-STD-
002B
Sn Whisker
GSI does not perform a tin whisker test in-house
RoHS-compliant package tin whisker is evaluated based
on data conducted by assembly subcontractor
GSI’s tin whisker criteria: < 50um w/ any L/F type

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Recommended* Reflow Profile at
MSL3 Preconditioning
Recommended* Reflow Profile at
MSL3 Preconditioning
*Per JEDEC Recommendations
*Per JEDEC Recommendations

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RoHS-Compliant Package
Roadmap
RoHS-Compliant Package
Roadmap
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Leadframe based packages:
TSOP II
Production
Leadframe based packages:
TQFP
Leadframe based packages:
SOJ (all lead counts)
Array packages:
uBGA (48 "U", 48 "X")
Array packages:
TFBGA (119, 209, 165 "D", 165 "E")
Production
Cust Qual/Sample
No RoHS-compliant/Pb-free packages will be offered for flip chip BGA devices.
Note:
Production
Development & Qual
Activities
2004
2005
Development & Qual
2006
Development & Qual
Cust Qual/Sample
Cust Qual/Sample
Development & Qual
Production
Cust Qual/Sample
Production
Development & Qual
Cust Qual/Sample

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